|
|
|
| Description
& Application |
| Stamping
Pin |
 |
| Use
in LED / Semiconductor Die-Bonding process. Paste with fluid
epoxy |
| glue |
|
| Application
Equipment： |
Automatic
Die-Bonder machines, such as |
|
ASM, NEC...etc. |
| Material： |
Nickel
alloy |
| Specification： |
1.
Standard types. |
|
2.
Customer-made for Customers’ needs. |
| |
|
|
|
|
|
| Description
& Application |
| Stamping
Pin |
|
| Use
in LED / Semiconductor Die-Bonding process. Paste with fluid
epoxy |
| glue |
|
| Application
Equipment： |
Automatic
Die-Bonder machines, such as |
|
ASM, NEC...etc. |
| Material： |
Ceramic |
| Specification： |
1.
Standard types. |
|
2.
Customer-made for Customers’ needs. |
| |
|
|
|
|
|
| Description
& Application |
| Stamping
Pin |
|
| Use
in LED / Semiconductor Die-Bonding process. Paste with fluid
epoxy |
| glue |
|
| Application
Equipment： |
Automatic
Die-Bonder machines, such as |
|
ASM,
NEC...etc. |
| Material： |
Nickel
alloy |
| Specification： |
1.
Standard types. |
|
2.
Customer-made for Customers’ needs. |
| |
|
|
|
|
|
| Description
& Application |
| Stamping
Pin |
|
| Use
in LED / Semiconductor Die-Bonding process. Paste with fluid
epoxy |
| glue |
|
| Application
Equipment： |
Automatic
Die-Bonder machines, such as |
|
ASM,
NEC...etc. |
| Material： |
Ceramic |
| Specification： |
1.
Standard types. |
|
2.
Customer-made for Customers’ needs. |
| |
|
|
|
|
|
| Description
& Application |
| Stamping
Pin |
|
| Use
in LED / Semiconductor Die-Bonding process. Paste with fluid
epoxy |
| glue |
|
| Application
Equipment： |
Automatic
Die-Bonder machines, such as |
|
ASM,
NEC...etc. |
| Material： |
Ceramic |
| Specification： |
1.
Standard types. |
|
2.
Customer-made for Customers’ needs. |
| |
|
|
